Epo tek h20e datasheet pdf

Its applications and field conditions include the optical, sensor, consumer, and industrial industries. Safety data sheet epotek 353nd part a ladd research. Identification product name epo tek h70e2 part a product no. It is also available in single component frozen syringes. Epotek h20efc is an electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and pcb circuit assembly. Safety data sheet epotek 302 part a paisley products. It is a snap cure version of epotek h20e, designed for snap cure at 140c and 15 minute cure at 120c. View datasheet for epoxy technology epotek ej2189lv. Epo tek med h20e is a biocompatible, silverfilled epoxy with electrical and high thermal conductivity.

Epo tek h20e 8 technical data sheet for reference only electrically conductive, silver epoxy epoxies and adhesives for demanding applications this information is based on data and tests believed to be accurate. Epo tek h70e is a 2 component thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronic applications. Epotek h20eslr is an electrically conductive, epoxy adhesive designed for solar ribbon bonding of photovoltaic modules. It is also used extensively for thermal management applications due to its high thermal conductivity. Wear protective clothing as described in section 8 of this material safety data sheet. Epotek n20e is a two component, electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly.

For reference only biocompatibleelectrically conductive. Epoxy technology relevant identified uses of the substance or mixture and uses advised against identified uses uses advised against users are recommended to seek further advice details of the supplier of the safety data sheet. H20e epotek silver conductive epoxy resin part a synonym. Emergency power off epo, windows and mac os x included poweralert ups monitoring software. Epo tek ek a new generation, single component eca with. The epotek 3012 is a two component medical, optical and semiconductor grade epoxy resin with long potlife, good handling characteristics and low viscosity. Epotek 353nd datasheet, cross reference, circuit and application notes in pdf format. Recent listings manufacturer directory get instant.

Identification product identifier product name epo tek 3012fl part a product number 3012fla recommended use of the chemical and restrictions on use application adhesive. Epotekh20e is a two component, 100% solids silverfilled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic. It was designed to be used in semiconductor jedec packaging, microelectronic packaging of hybrids, as well as high temperature devices and assembly. Epotek h20e is a two component, 100% solids silverfilled epoxy paste designed specifically for chip bonding in microelectronic and optoelectronic applications.

Epo tek 353nd has excellent resistance to many types of solvents and chemicals and. H20e pfc is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solderfree joining method. Epotek adhesives are used for many reasons, including. To be used as a guide only, not as a specification. Epoxy technology epotek 377h is a 2 part part apart b, epoxy, pourable liquid used to seal, bonding, encapsulating, and potting ceramic, stainless steel, and glasses. Identification product name epo tek h20e part a product no. Epo tek 353nd datasheet, cross reference, circuit and application notes in pdf format. Accidental release measures personal precautions, protective equipment and emergency procedures personal precautions wear protective clothing as described in section 8 of this safety data sheet. Epotek h20e electrical epoxy paisley products of canada inc. Epotek h20s is a modified version of epotekh20eassembling and repairing can be completed instantly using the fast drying adhesives. Epotek h77 is a thermally conductive, electrically insulating epoxy system designed for lidsealing of hybrids found in hermetic packaging of microelectronics.

H20e epotek silver conductive epoxy hardener part b synonym. Crimp support longer working time is needed, use epotek 353nd epoxy instead for this step only. Epotek h20s adhesive, electron microscopy sciences vwr. Product name epo tek t7110 part a product number t7110a.

Product name epo tek h20e 175 part a product number h20e 175a. Efficiently fixing various materials together, the substances tightly bond items to resist separation even under intense. Epo tek h20e part a epo tek h20e part a not applicable epo tek h20e part a mixture mixture not available. Identification product identifier product name epo tek h20e part a product number h20e a recommended use of the chemical and restrictions on use application adhesive. It provides the electrical backcontact for ribbon stringing of solar cells into modules and panels. Msds for h22 epotek part a, 16016, university of waterloo. It is a reliable system, making it the conductive adhesive of choice for new applications.

Especially recommended for use in high speed epoxy chip bonding systems where very fast cures are desired. Personal precautions wear protective clothing as described in section 8 of this material safety data sheet. Epotek h20e is a two component, 100% solids silverfilled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. Environmental precautions do not discharge ontothe ground or into water courses. Package types can be plastic, metal cases or ceramic. Msds for h22 epotek part b, 16016, university of waterloo. Identification product identifier product name epotek h20e part a product number h20ea recommended use of the chemical and restrictions on use application adhesive.

Epo tek h20s is a highly reliable, two component, silverfilled epoxy with a smooth. The epoxy can be screened or dispensed onto the circuit board surface prior. Epoxy technology epotek ej2189lv is a 2 part 2part cure, epoxy, smooth flowing paste used to adhesive ceramics, metals, and engineering plastics. Epoxy technology epotek ej2189lv adhesive epoxy 2 part. Epo tek h20e is a two component, 100% solids silverfilled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. Identification product name epo tek 330 part a product no. H70e comes in a 1 pound, two part kit and is stored at room temperature. Environmental precautions do not discharge into drains, water courses or onto the ground. It is also used for thermal management applications due to its high thermal conductivity. Epotek h20e technical data sheet for reference only electrically conductive, silver epoxy epoxies and adhesives for demanding applications this information is based on data and tests believed to be accurate.

Epoxy technology epotek n20e electrically conductive paste. Uses advised against use only for intended applications. Recommended use of the chemical and restrictions on use. Epotekh20efc is a twocomponent, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and pcb circuit assembly.

It is a snap cure version of epotek h20e, designed for snap cure at 140c and h20e, including ink jet heads, mems and ultrasound devices automotive applications include pressure sensing and accelerometer circuits electrically conductive adhesive eca for connections of circuits to cu coils in rf antenna applications such as smart cards and rfid tags. Depending on if the ingredients chemically react to harden, fixative options are reactive or nonreactive to fit application needs. It is also used extensively for thermal management applications due to. Identification product name epo tek h20e pfc part a product no. Identification product identifier product name epo tek 353nd part a product number 353nda recommended use of the chemical and restrictions on use application adhesive. H20e is used extensively for thermal management applications due to its high thermal conductivity. Other benefits include low viscosity and high thixotropy making it suitable for a wide range of application techniques.

Epo tek h20e and one underfill material loctite hysol fp4549 determine, manufacturers were 125oc for emi emcast 501 epoxy, 80oc for epo tek h20e and 140oc for hysol fp4549 underfill. Capable of resisting tc wire bonding temperatures in the range of 300c to 400c. Environmental precautions environmental precautions do not discharge into drains or watercourses or onto the ground. Details of the supplier of the safety data sheet supplier epoxy. Epo tek h20s technical data sheet for reference only electrically conductive, silver epoxy for. It is a well characterized and relied upon eca, with over 40 years of successful design use. Also available in a single component frozen syringe. Safety data sheet epotek od2002 part a fiber optic center. Details of the supplier of the safety data sheet supplier epoxy technology, inc.